Microelectronics Packaging Engineer
Samtec, Inc
Colorado Springs, CO

About $62,000 - $84,000 a year

Founded in 1976, Samtec is a privately held, $700 million global manufacturer of a broad line of electronic interconnect solutions. What drives us at Samtec is the knowledge that our products enable engineers to create great things. When we innovate electronics capable of moving signals at faster speeds, smaller footprints, and higher densities, we know that we’re providing designers access to the technologies that they need to do the jobs that impact all of our lives. Whether it’s advanced medical equipment with the ability to save lives, energy efficient products that make our living spaces more comfortable, communications products that bring us together, or any number of other innovations, we feel good about our part in making those things possible. With 33 locations in 18 different countries, Samtec’s global presence enables its unmatched customer service.

Samtec began investing in Microelectronics in 2010 and has emerged as a technology leader in advanced glass-based packages. As we build on our core technologies, advanced materials development is mission critical for our applications, requiring world class materials research by innovative experts responsible for increasing our lead. We see great things ahead for our Glass Core Technology group and will drive our exciting roadmap with talented people:

Through Glass Via (TGV) Metallization
Breakthrough Integration to Redistribution Layer (RDL) circuit formation
Tomorrow’s advanced packages and applications
Wafer level processing technologies

For more information, check us out at www.samtec.com/microelectronics

Position Description:
The Packaging Development Engineer provides engineering design, integration and production of 2.5D and 3D Packaging solutions for RF MEMS, MEMS, Life Sciences, Biomedical, Biometric Sensors, Micro-displays, Optoelectronics, and RF/Digital Components.
This position will support the design, development, and transition of engineering prototypes to production of TGV (Through glass via) wafers and packaging solutions with the following responsibilities.

Essential Functions/Responsibilities:
“Move the ball forward” by proactively work to achieve challenging goals when developing a new product or process.
Design and demonstration of high performance thin film coatings and circuit generation from the coatings that meet market demand.
Design and demonstration of high performance vias in glass and other substrates as required
Oversight of the production process (includes process controls, metrics, etc.) from receipt of substrate, through via process, the coating process, and final test and verification of coating performance against specification, and circuit generation for RDL of interposers.
Plating understanding and know-how to work with internal and external facilities, ENIG and ENEPIG finished products for interconnection, wire bonding, flip chip and soldering of components.
Document and distribute reports outlining experimental conditions and test results.
Lead root cause analyses.
Support customer proposal activities.
Interface with customers (internal and external), as required.
Development of material deposition processes, chemistries and techniques and coinciding circuit generation techniques after the coatings.
Develop new processes on thin glass substrates and wafers for high performance coatings for Redistribution Layer (RDL) circuits (g., thick film, thin film, passivation, oxides, nitrides, etc.)
Testing and evaluation of products, electrical, mechanical, thermal cycling and aging, humidity, Bias, HHBT and other characterization methods used in the industry and customers.
Participate in joint development activities with customers.
Work with both marketing and engineering/R&D teams.
Participate in the design, development, and characterization of new component, sub-system, and entire system designs for deposition, etching and surface modification for next generation microelectronic packaging solutions.
Submit IP documentation or protecting company technical.
Publish technical papers and present them at conferences and technical meetings.
Work in a dynamic, intellectually stimulating team-based environment.
Understand drivers of customer satisfaction and strive to improve customer experiences.
Travel required to other company sites, vendors, customers, conferences, and technical meetings.

Required Skills:
Prior packaging industry experience is strongly preferred.
Knowledge of semiconductor manufacturing, packaging fundamentals, and characterization techniques.
Knowledge in engineering design tools: AutoCAD, Pro Engineer, SolidWorks, Autodesk Inventor, ADS, ANSYS HFSS.
Knowledge of statistics, process control systems and use of statistical tools/methods.
A strong understanding of materials competence, microelectronic packages, Through Glass Via (TGV), Through Silicon Via (TSV), and Thermal Interface Material (TIM)
Experience in documenting procedures and training personnel in techniques.
At least 10 years previous experience in a similar role.

Desired Skills:
Independent problem-solving techniques
RF assembly and design knowledge
Familiarity with proto-type assembly issues that impact testability
Knowledge of micro-electronic materials and processes
Ability to work in a multi-disciplined engineering environment
Ability to meet International Traffic in Arms Regulations (ITAR) compliance requirements a must

Required Education:
BS/MS of Science degree or equivalent in either Electrical or Mechanical Engineering
SAMTEC, Inc. is an Equal Opportunity Employer and committed to creating a diverse environment. All employment decisions at Samtec are based on business needs, job requirements and individual qualifications, without regard to race, color, religion or belief, national, social or ethnic origin, pregnancy or parental status, age, disability, sexual orientation, gender and/or gender identity/expression, marital status, past or present military service, family medical history or genetic information, or any other status protected by applicable laws.