Semiconductor Packaging Engineer -Undergraduate Intern Folsom
Intel
Folsom, CA
Job Description
The Non-Volatile Memory Solutions Group in Folsom, CA is looking for a full-time paid intern or engineering co-op undergraduate student to support microelectronic packaging technology development projects that will involve a combination of project management and hands-on package failure analysis work (cross-section analysis, SEM, optical microscopy, x-ray, CSAM). Intel will provide on-the-job training on the failure analysis procedures and techniques. Through comprehensive failure analysis, the candidate should be able to find the root cause for failures, provide regular updates, and summarize findings in a presentation report.

This position involves working with design engineering, quality and reliability engineering, and planning to coordinate assembly experiments, and support data collection and analysis for packaging experiments. Additional project responsibilities will be added once the projects begin.

Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences. This is an entry level position and will be compensated accordingly.

This U.S. position is open to U.S. Workers Only. A U.S. Worker is someone who is either a U.S. Citizen, U.S. National, U.S. Lawful Permanent Resident, or a person granted Refugee or Asylum status by the U.S. Government. Intel will not sponsor a foreign national for this position.

Minimum Requirements:
The candidate must be pursuing a BS degree in Materials Science, Metallurgical Engineering, Ceramic Engineering, Chemical Engineering, Mechanical Engineering, or related field.

3 months of experience in the following areas:
Electronic materials
Materials characterization techniques
Materials sample preparation
Expected intern/co-op duration is 6 months to 12 months.

Preferred Requirements:
Semiconductor materials processing, electronic materials, microelectronic packaging, and/or materials failure analysis experience

Inside this Business Group
Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance....