ASML US brings together the most creative minds in science and technology to develop lithography machines that are key to producing faster, cheaper, more energy-efficient microchips. We design, develop, integrate, market and service these advanced machines, which enable our customers - the world’s leading chipmakers - to reduce the size and increase the functionality of their microchips, which in turn leads to smaller, more powerful consumer electronics. Our headquarters are in Veldhoven, the Netherlands, and we have 18 office locations around the United States including main offices in Chandler Arizona, San Jose and San Diego California, Wilton Connecticut, and Hillsboro Oregon.
For the development of novel mechanical solutions in the area of Extreme UV technology (EUV) we are seeking an experienced Mechanical Engineering Architect who has the ability to perform a variety of engineering architect functions including path-finding, defining trade studies, completing feasibility analysis and defining the extensibility and risks of the chosen design.The Mechanical Engineering Architect will also work with the hardware design team to define the functional requirements and ensure that the design intent is carried within the product to the field.
This position requires access to controlled technology, as defined in the Export Administration Regulations (15 C.F.R. § 730, et seq.). Qualified candidates must be legally authorized to access such controlled technology prior to beginning work. Business demands may require ASML to proceed with applicants who are immediately eligible to access controlled technology.
DUTIES AND RESPONSIBILITIES
Leads the development of the Mechanical Architecture within the EUV source plasma chamber to enable the Tin Droplet Generation function and assist in developing the product roadmap with the function owner and project lead.
Contribute as Mechanical domain expert to apply a broad range of fundamental mechanical engineering knowledge including but not limited to thermal system design, fluid dynamics, and manufacturing techniques for refractory metals.
Assist in defining functional requirements, driving FEA/CFD analysis, completing trade studies and driving the design down selection process.
Establishes the mechanical, thermal, vacuum and gas flow/pressure system design requirements.
Audits the resulting designs and analyses of the engineering team to verify fulfillment of the requirements including writing and executing test plan and result reviews.
Works closely with cross-functional groups to understand the current product issues and develop integrated solutions.
Engages engineers, scientists, worldwide customer support, manufacturing, marketing and upper management to gain alignment and drive the implementation of the Tin Droplet Generation function.
Participate in the development of patent applications.
Requires a Bachelor’s Degree in Mechanical, Physics, or Material Science and a minimum of twelve (12) years of relevant experience; or a Master’s Degree in Mechanical, Physics, or Material Science and a minimum of ten (10) years of relevant experience; or a Ph.D. and a minimum of eight (8) years of relevant experience
A minimum of four years of experience in plasma chamber thermal technologies and system design.
Broad technical knowledge of all aspects of thermal designs, gas flow, vacuum performance and material and manufacturing techniques for components in extreme temperature and liquid metal environments.
Able to identify key supporting technologies related to optics protection; help to identify project plans, priorities, risks and activities.
Experience with complex thermal system design and analysis, with emphasis on liquid metal interactions.
Ability to cross functional boundaries to build relationships within all areas in the company, to understand and reconcile higher level requirements and drive successful design implementation.
Demonstrated ability to drive a product design from concept through validation test and into production.
Working knowledge of robust engineering principles, DFX and DOE methodologies.
Excellent English written and verbal communication skills.
Knowledge of metallurgical deposition is a plus.
Experience with semiconductor gas and vacuum systems for capital equipment is preferred.
Experience with contamination and cleanroom standards is preferred.
Experience with semiconductor capital equipment tool development is preferred.
PHYSICAL DEMANDS AND WORK ENVIRONMENT
While performing the duties of this job, the employee routinely is required to sit; walk; talk; hear; use hands to keyboard, finger, handle, and feel; stoop, kneel, crouch, twist, reach, and stretch.
The employee is occasionally required to move around the campus.
The employee may occasionally lift and/or move up to 20 pounds.
Specific vision abilities required by this job include close vision, color vision, peripheral vision, depth perception, and ability to adjust focus.
Can work under deadlines.
Requires working with a firing laser on a frequent basis with associated safety protocols.
Requires working in a manufacturing clean room environment occasionally.
May require travel, both domestically and internationally, dependent on business needs.
EOE AA M/F/Veteran/Disability