As an entry level Packaging Engineer, you will:
Assist in the design and development of new package, process flow and materials in support of Sensor Business Unit and Power IC Business Unit.
Create AutoCAD drawings and 3D models and specifications for new packages.
Create DFMEA and other necessary documentation to fulfill APQP requirements.
Support qualification and transition of new package to mass production.
Manage project schedule and deliverables and maintain the documents in SharePoint.
Work closely with cross functional teams on new package development and optimization of current packages.
Work closely with in house assembly sites AMPI and AMTC, as well as subcons and suppliers for new package development.
The successful candidate will possess a BS or MS in Mechanical Engineering or Materials Science with 0-1 years of experience in semiconductor packaging design, development and operations/manufacturing. You must also possess the following:
Proficient in the use of AutoCAD, familiar with GD&T standards;
Experience in 3D design software such as any of Autodesk Inventor, SolidWorks, Pro-E, etc;
Understanding of design for manufacturability in process and product development and f amiliar with FMEA;
In depth understanding of the mechanical stress due to CTE mismatch between packaging materials in order to build a robust package; Experience of using simulation software such as ANSYS, SolidWorks Simulation, Autodesk Simulation is a plus;
Some knowledge of the material properties of packaging materials, such as epoxies, solders, molding compounds, metals, plastics, etc;
Familiar with project management and APQP process;
Excellent written skill to create specifications for new package designs;
Excellent communication skill to interact with various internal groups, suppliers and sub contractors.