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All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, citizenship, disability or protected veteran status.
Stabilize and improve equipment availability and performance
Provide technical leadership in identifying, evaluating, improving and maintaining equipment
Implement robust monitoring methodologies enabling early detection of excursions in equipment performance before product is impacted (e.g. SPC, FDC, baselining & matching)
Develop and implement preventative, predictive and high precision maintenance procedures. Implementation includes documenting procedures, as well as training and certifying personnel
Own improvement of equipment related metrics such as scrap, availability, process control & equipment maintenance costs
Works with peers and the unit process engineering/equipment maintenance teams to establish project objectives, schedules and resource profiles for projects. Organizes and manages longer term improvement projects to meet organizational goals
Collaborate with Process Engineering, Equipment Maintenance and Manufacturing Operations to achieve robust performance in support of yield, quality and productivity goals
BS in ME, EE, ChemE, or Materials Science, and a working knowledge of RF, Plasma, and thin films experience as an engineer or intern supporting plasma etch equipment in a MEMS/semiconductor HVM environment. Experience with Lam Research 2300 Exelan and Lam Research (Novellus) GxT dry strip platforms preferred.
Detail oriented with strong fundamentals in core equipment engineering functions
Excellent diagnostic and troubleshooting skills for process/equipment interactions
Practical experience applying structured problem solving methods
Working knowledge and practical experience with SPC, DOE and statistical hypothesis testing
Data analysis skills using tools such as JMP, Minitab, Spotfire and Excel/Access
Excellent verbal and written skills. Commitment to effective communication
Initiative to address and appropriately escalate problems to achieve rapid resolution
Legal authorization to work in the U.S.
Candidates with practical experience in Fault Detection & Classification (FDC) systems, Copy Exactly (CE!) methodology, High Precision Maintenance (HPM), TPS, and Lean will be considered preferentially.
Basic understanding of MEMS and active device micro-fabrication techniques is highly desirable
If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.