Metrology and Defect Inspection TD Process Engineer
Albuquerque, NM

About $72,000 - $93,000 a year

Job Description
Intel's 3D XPoint TM is a new breakthrough in non-volatile memory technology and is revolutionizing the NVM landscape and storage/memory as we know it. This is one of the key pillars for NSG's Non-Volatile Memory Solutions Group growth and is a critical element of Intel's overall connected platform strategy. We are looking for Technology Development Engineers in Metrology and Defect Inspection area.

The ideal successful candidate will:
Strive to achieve and deliver leading edge process capability, yield, cost and manufacturability. This will involve exceptional collaboration with cross-functional/cross-company teams and tool vendors to meet challenging program goals.
Define the technology development roadmaps to meet requirements, goals and milestones for a new process.
Define and establish flow, procedures, and equipment configuration.
Select and develop material and equipment for the process to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
Plan and conduct experiments to fully characterize/understand the process throughout the development cycle.
Develop strategy to resolve difficult problems and establish systems to deal with these problems in the future.

The ideal candidate will be able to:
Demonstrate experience with technical problem solving skills, with multitasking
Be a fast learner, able to adapt to the culture and the technology
Be flexible in accommodating changing priorities and working hours to support business needs


You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.

Minimum Requirements

The candidate must have a MS or PhD degree in Electrical Engineering, Chemical Engineering, Mechanical Engineering, Material Science, Physics, or Chemistry.

3+ years of experience in the following areas:
Semiconductor FAB processing.
Statistical Process Control SPC or Design of Experiments DOE principles.
Semiconductor process development.
Preferred Requirements

12+ months of experience in the following areas:
Volatile and/or non-volatile memory.
Metrology and defect inspection techniques.
Inside this Business Group
Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.

Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance....