SPTD Packaging R&D Engineer
Intel
Phoenix, AZ

About $66,000 - $90,000 a year

Education
Job Description
This position is an External Substrate Supplier Integration Engineer role within Substrate Packaging Technology Development (SPTD) and the candidate will be in charge of working with suppliers in Asia to develop their next gen equipment & processes and partner with the internal cross function teams to deliver technology certification and high volume ramp.

This is an entry level position and compensation will be given accordingly.

Responsibilities will include, but not be limited to:
Develop and execute efficient and robust substrate technology certification strategies and plans, and deliver to program and product technical and schedule requirements.
Drive improvements on quality, reliability, cost, yield, and process capability at substrate suppliers.
Partner with internal key stakeholders to understand substrate assembly/reliability issues and identify potential root cause and drive technology improvements at the substrate suppliers and Intel assembly processes.
The candidate should also exhibit the following behavioral traits or/and skills:

Problem solving skills, and an aptitude and capability to deep dive into fundamental root cause and identify robust solution for technical issues
Ability to work in highly matrixed organization across partner groups, cultures and time zones
Collaborating closely with internal partners and customers to deliver program and organizational requirements

Qualifications

You must possess the below minimum qualifications to be initially considered for this position.

Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Knowledge and/or experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.

Minimum

Ph.D. with 12 months experience in one of the following majors: Materials Science and Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering, Mechanical Engineering, or related engineering degree
Preferred

Tool and process PCS, data analysis, statistical tools and methods
Material characterization techniques such as SEM, XPS, FTIR, FIB etc
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art - from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance....