Packaging R&D Engineer - Temporary Contract
Intel
Phoenix, AZ

About $66,000 - $91,000 a year

EducationSkills
Job Description
The Thermal & Fluids Core Competency (TFCC) Lab at Intel has a temporary contact position to work on thermal characterization metrologies in the field of electronic packaging.

A variety of tools are used in the TFCC lab to study the thermal performance of an electronic package under different thermal boundary conditions: these tools include both steady-state and transient approaches spanning both point and full-field thermal measurement equipment.
The lab data is leveraged to influence package design and solve issues encountered during technology development.
The position involves design of experiment, setup definition including fabrication, sample preparation, data collection & analysis, report presentation, and documentation.
Another key activity for the lab personnel is development of new metrologies for enabling next-generation packaging technologies.
The candidate should have background in heat transfer and fluid dynamics and display good problem solving skills and work well in a team.
Temporary Contract: 12 months

Qualifications

This U.S. position is open to U.S. Workers Only.

A U.S. Worker is someone who is either a U.S. Citizen, U.S. National, U.S. Lawful Permanent Resident, or a person granted Refugee or Asylum status by the U.S. Government.

Intel will not sponsor a foreign national for this position.

You must possess the below minimum qualifications to be initially considered for this position.

Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Knowledge and/or experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.

Minimum

Possess a bachelor's degree or master's degree in Mechanical Engineering or Materials Engineering or Related field with 6 months experience.
Background in heat transfer and fluid dynamics.
Be able to demonstrate the ability to successfully apply the fundamentals of heat transfer/fluid dynamics to the characterization of the IC/package and enabling solutions.
Experimental background with hands-on experience with data acquisition and sensors is required along with familiarity with commercial software, LabVIEW / MATLAB.

Preferred

Familiarity with CAD software (such as Solidworks).
Understanding of semiconductor fabrication processes and technology.
Knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles.
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art - from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance....