Microelectronics Packaging Engineer (668704)
Ball Aerospace
Boulder, CO

About $73,000 - $98,000 a year

Who We Are:
Ball Aerospace pioneers discoveries that enable our customers to perform beyond expectation and protect what matters most. We create innovative space solutions, enable more accurate weather forecasts, drive insightful observations of our planet, deliver actionable data and intelligence, and ensure those who defend our freedom go forward bravely and return home safely. For more information, visit http://www.ball.com/aerospace, Facebook or Twitter.

Microelectronics Packaging Engineer

What you'll do:
Work as part of a team of engineers and scientists responsible for micro-electronics packaging design and manufacture of focal plane arrays.
Responsibilities include the design and process development for the manufacture of packaging for focal plane array.
You will manufacture focal planes in a Class 100 cleanroom.
Maintain a regular and predictable work schedule.
Establish and maintain effective working relationships within the department, the Strategic Business Units, Strategic Support Units and the Company. Interact appropriately with others in order to maintain a positive and productive work environment.
Perform other duties as necessary.

What you'll need:
BS degree in Engineering or a related technical field, such as Electrical Engineering, Physics, Material Science, Chemistry or Mechanical Engineering, plus 5 or more years of related experience.
Each higher-level degree, i.e., Master’s Degree or Ph.D., may substitute for two years of experience. Related technical experience may be considered in lieu of education. Degree must be from a university, college, or school which is accredited by an agency recognized by the US Secretary of Education, US Department of Education.
Experience with mechanical packaging of detectors and associated thermal and contamination constraints.
Knowledge of microelectronic packaging of focal plane arrays or related products, including 5 or more years’ experience.
Knowledge of die attach, wirebonding; adhesive technology; interconnect technologies including soldering; cleaning techniques such as vacuum bake, plasma etch, and liquid chemical processes; precision alignment; thin film deposition; thermal control and structural designs.
Knowledge of assembly protocols in Class 100 cleanroom and contamination mitigation.
Experience with optical bonding, optical coatings, and use of optical lenses and filters.
Hands-on laboratory experience.
Experience with vacuum and cryo-thermal systems.
Proficiency in MS Office tools.
Excellent interpersonal skills and demonstrated oral and written communication skills.
Related technical experience may be considered in lieu of education.

Working Conditions:
Work is performed in an office, laboratory, production floor, or cleanroom, outdoors or remote research environment.
May occasionally work in production work centers where use of protective equipment and gear is required.
May access other facilities in various weather conditions.
Travel and local commute between Ball campuses and other possible non-Ball locations may be required.

Security Clearance:
Successful applicant for this position must be eligible to obtain a DoD clearance or government customer access to classified/sensitive material. A current DoD clearance is not required to be eligible for this position, however the successful applicant will be required to obtain a DoD clearance or government customer access within a reasonable time after the offer is extended and must be able to maintain the applicable clearance. *US Citizenship is Required. By applying to this position you are agreeing to complete a National Security Clearance Pre-Screen Questionnaire, if one is required, to evaluate your general ability to obtain the required security clearance or government customer access associated with this position.

Relocation for this position is Available

EEO Statement:

Ball Aerospace is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, pregnancy, sexual orientation, gender identity, national origin, age, protected veteran status, or disability status.