Design, develop, and support next-generation FPGA and RF products in an exciting high growth market. The fast-paced Abaco RF&DSP team develops leading edge ruggedized ADC, DAC, and digital signal processing products as part of a global company providing turnkey and off the shelf solutions for the defense and science industries. New challenges arise every day that require sharp problem-solving skills of talented and smart individuals. Join us in a collaborative and hands-on environment that fosters engineering excellence, creativity, and innovation.
“We are looking for highly motivated Mechanical Engineers with excellent design and debug skills, to help design and deploy our market leading products. You will engage in a collaborative, rapidly-changing environment to design and support groundbreaking new technologies. In this position, you will focus on mechanical solutions for rugged environments, thermal and structural simulations, as well as prototype product assembly and testing.”
Design, develop, modify and evaluate electronic packaging for use in Mil/Aero applications.
Determine design approaches and parameters.
Model components and systems as well as create drawing packages for fabrication.
Perform structural and CFD thermal analysis of electronic systems.
Support vibration and thermal testing of aerospace systems.
Support board and system builds.
Interface with customers and vendors to ensure product/component performance to customer specifications and to appropriate standards.
Other duties as assigned.
Bachelor’s degree in Mechanical or Aeronautical Engineering from an accredited university or college.
Highly motivated with the ability to make decisions and solve problems with little supervision.
10+ years mechanical design experience, including thermal analysis, CFD analysis, structural analysis, and vibration analysis.
Experience using SolidWorks or 3D CAD software.
Broad understanding of Materials and Processes used in the electronic packaging.
Familiarity with dynamic and thermal testing.
Experience performing root cause analysis.
Experience mentoring junior level engineers.
Familiarity with military requirements.
Background in designing rugged military electronic systems and PCBs is desired.
Ability to work in teams and achieve design and schedule targets while managing design constraints.
Strong oral and written communication skills.
Strong interpersonal and leadership skills.
US Citizen or permanent resident.