You will be a member of the Assembly organization at Intel's Ronler Acres campus. This new Assembly process is an integral part of the Foveros technology that Intel announced in 2019.
Process Integration Engineers are responsible for partnering with process engineering, manufacturing, Q&R, and support teams to drive process sustaining excellence, responding to and driving resolution of process quality events, change control, and new product introduction.
Responsibilities may include, but are not limited to:
Responding to quality events in the high-volume manufacturing process line, containing and dispositioning suspect material, and driving preventative measures.
Partner with process engineering to drive integrated process margin improvements.
Leading taskforces through model based problem solving methodology to resolve process excursions.
Partner with Technology Development to develop and qualify process improvements.
Develop strong partnerships with Die Prep/Sort Process engineering, Manufacturing, Q&R, Product engineering, and Technology development teams.
The ideal candidate should exhibit the following:
Excellent data analysis, and problem-solving skills.
Strong organizational skills with great attention to detail.
Strong interpersonal skills to work across diverse work groups.
Excellent communication & presentation skills.
Positive attitude with strong technical leadership skills.
This is an entry level position and will be compensated accordingly.
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Relevant experience can be obtained through schoolwork, classes and project work, internships, military training, and/or work experience.
Candidate must possess a Master’s degree or PhD in Material Science, Chemistry, Physics, Electrical, Chemical, or Mechanical Engineering or related field.
Minimum of 2-year wafer fab, die preparation, or assembly experience.
Candidate must be willing to relocate to Arizona for 3+ months for training.
Experience with Wafer fab or Die Prep process engineering
Knowledge of statistical process control techniques, JMP/SQL data analysis tools.
Knowledge of F/A tools such as SEM, EDX, etc.
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art - from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance....